Intel has officially announced Lakefield, a new SoC series featuring Foveros, a 3D stacked packaging technology. Lakefield is a hybrid CPU that combines Core i3 and i5 processors and a low-power Atom-based Tremont core.
Poberos does not place components on a single circuit board like conventional CPUs, but stacks them to enable minimal space configuration including DRAM. According to Intel, this approach is advantageous for mobile devices by increasing power efficiency. Compared to the 8th generation core processor, the device’s standby power consumption can be reduced by 91%.
Intel explains that Lakefield is a SoC suitable for ultra-thin notebooks such as Samsung Electronics’ Galaxy Book S, clamshell display devices such as ThinkPad X1 Fold, and Surface Neo, Microsoft’s dual-screen tablet.
The Core i3-L13G4 and i5-L16G7 processors, which are made through the 10nm manufacturing process, adopt the Sunny Cove architecture and handle heavy-duty applications. Tremont, an atom-based core, satisfies the 14nm manufacturing process and is used for background operation optimization. You can also decide whether to run your application on the Sunny Cove core or Tremont core to optimize the operating system scheduler performance.
Intel explains that the Core i5-L16G7 is up to 24% better in web browsing than the Core i7-8500Y, and 12% higher in single-threaded integer arithmetic. In addition, the 11th generation of integrated graphics provides up to 1.7 times the performance of the Core i7-8500Y. For detailed specifications, Core i5-L16G7 is equipped with 1.4GHz single core, 5 cores, 5 threads, 64 graphics cores up to 3GHz, and 4MB of cache. Core i3-L13G4 is 800MHz single core, 5 cores and 5 threads at up to 2.8GHz, 48 graphics cores. , I put 4MB of cache. All GPU frequency clocks are 500MHz and support LPDDR4X-4267 RAM. Related information can be found here .