Qualcomm’s 3rd generation 5G modem’Snapdragon X60′

Qualcomm has announced a new modem chip for 5G mobile communications, the Snapdragon X60.

This product is the 3rd generation 5G modem embedded in smartphones and adopts a 5nm manufacturing process. The communication speed is up to 7.5Gbps in the downlink and 3Gbps in the upstream. Qualcomm said that a network consisting of 5G alone will double the maximum speed of the sub-frequency band. In addition, it supports the carrier aggregation technology CA (Carrier Aggregation) combination that increases speed by combining the frequency bands by supporting major 5G frequency bands used in 5G services around the world. In other words, it is possible to cope with 5G communication services around the world by installing a modem chip in a smartphone.

CA is the first in the world to support a combination of two frequency bands used in 5G, called millimeter wave and sub6. Among sub6, combinations of more than two communication methods FDD and TDD are possible. The new QTM535 antenna module for the millimeter wave equivalent to the X60 modem was also announced, making the design more compact than ever. In addition, the X60 modem supports 4G LTE, 3G ((WCDMA, TD-SCDMA, CDMA 1x) and 2G (GSM / EDGE), which are existing mobile communication technologies. In addition, the X60 modem also supports VoNR, a 5G calling technology. Qualcomm supports VoNR. Explaining that the global mobile industry will be an important step toward transitioning to 5G standalone.

The Snapdragon X60 modem will be sampled to smartphone manufacturers for a limited time in the first quarter, and the installed smartphone is expected to be realized in high-end models released in early 2021. Related information can be found here .